Tools

3pcs universal BGA Stencils for Samsung HTC Huawei Android MTK Directly Heated BGA Reballing Stencils Kit

Rating
$4.50





universal BGA Stencils for Samsung HTC Huawei Android MTK Directly Heated BGA Reballing Stencils Kit

Specification :

this 3 pieces bga stencils tin plate was for samsung huawei Android MTK series chip IC reballing repair .

package including

for MTK series A90 stencil x 1

48 in 1 S5026 for samsung series stencil x 1

A418 for samsung HTC HUAWEI android MTK combanation combination x 1

  • Model Number: s universal BGA Stencils for phone
  • DIY Supplies: Electrical

  • Package Weight: 0.05kg (0.11lb.)
  • Package Size: 5cm x 2cm x 2cm (1.97in x 0.79in x 0.79in)
  • Unit Type: piece